Intel Stock

Intel Corporation (Intel) operates as a global integrated device manufacturer (IDM) of processor or central processing units (CPUs) and related solutions that it designs, develops, manufactures, markets, sells, supports, and services.

Products

The company’s CPUs and related solutions are incorporated in computing and related end products and services, and utilized globally by consumers, enterprises, governments, and educational organizations. The company’s customers primarily include original equipment manufacturers (OEMs), ODMs, cloud service providers, and other manufacturers and service providers, such as industrial and communication equipment manufacturers and other cloud service providers who buy its products through distributor, reseller, retail, and OEM channels throughout the world. The company markets and sells these products directly through its global sales and marketing organizations and indirectly through channel partners. The company manufactures its products at its fabrication and assembly and test facilities located throughout the world.

The company’s product offerings provide end-to-end solutions, scaling from data center to network, PCs, edge computing, and the emerging fields of artificial intelligence (AI) and autonomous driving, to serve an increasingly smart and connected world. Products, such as the company’s gaming CPUs, may be sold directly to end consumers, or they may be further integrated by its customers into end products, such as notebooks and storage servers. Combining some of these products—for example, integrating field-programmable gate array (FPGAs) with Intel Xeon processors in a data center solution—enables incremental synergistic value and performance.

In 2023, the company launched new products, including the 13th Gen Intel Core mobile processor family, the 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost, and the Intel Core Ultra processors, which feature its first integrated neural processing unit for power-efficient AI acceleration and local inference on the PC. Product offerings provide end-to-end solutions, scaling from data center to network, PCs, edge computing, and the emerging fields of AI and autonomous driving, to serve an increasingly smart and connected world. Products, such as the company’s gaming CPUs, may be sold directly to end consumers, or they may be further integrated by its customers into end products, such as notebooks and storage servers. Combining some of these products—for example, integrating FPGAs with Intel Xeon processors in a data center solution—enables incremental synergistic value and performance. In 2023, the company launched new products, including the 13th Gen Intel Core mobile processor family, the 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost, and the Intel Core Ultra processors, which feature its first integrated neural processing unit for power-efficient AI acceleration and local inference on the PC.

The company’s diverse product line includes CPU and chipset, a system on a chip (SoC), or a multichip package based on Intel architecture that processes data and controls other devices in a system. The primary CPU products in CCG are the company’s Intel Core processors, which include designs specifically for notebook and desktop applications. The primary CPU product in DCAI is the company’s Intel Xeon processor, which includes solutions for data center compute, networking, and the intelligent edge. The primary offerings of NEX include Intel Xeon, Intel Core, and Intel Atom processor products.

Segments

The company operates through Client Computing Group (CCG), Data Center and AI (DCAI), Network and Edge (NEX), Mobileye, and Intel Foundry Services (IFS) segments.

CCG segment

This segment is committed to advancing PC experiences by delivering an annual cadence of leadership products and deepening its relationships with industry partners to co-engineer and deliver leading platform innovation. The company engages in an intentional effort to bring together the operating system, system architecture, hardware, and software application integration to enable industry-leading PC experiences. It embraces these opportunities by focusing its roadmap, delivering innovative PC capabilities, and designing advanced PC experiences. By doing this, the company helps continue to fuel innovation across the industry, providing a solid source of IP, scale, and cash flow for Intel.

The company launched its 13th Gen Intel Core mobile and select desktop processors, Intel Core 14th Gen processors, and Intel Core Ultra processors, the first client processor family on Intel 4 technology that features a new neural processing unit to drive AI at scale. It launched the industry's first AI PC Acceleration Program to help enable AI on more than 100 million PCs through 2025.

Products and Competition

The company released its 14th Gen Intel Core desktop processor family, delivering improved single-threaded and multi-threaded performance when gaming, streaming, and recording. In addition, the company released its first Intel Core Ultra family of processors, which utilizes a disaggregated architecture and is the first PC platform built on Intel 4 technology. The company’s latest processor family is the first client processor to feature a dedicated NPU for AI acceleration and delivers improved power efficiency and graphics performance. Intel Core Ultra represents an inflection point in Intel's client processor roadmap as the company ushers in the age of the AI PC. With new capabilities in the PC, including significantly improved battery life, AI capabilities with the company’s neural processing unit (NPU) and Graphics processing unit graphics processing unit (GPU) products, and up to double the graphics performance with Intel Core Ultra processors, it seeks to provide compelling reasons to drive refresh in commercial and consumer markets. The company expects to deliver more than 230 Intel Core Ultra designs to market.

There is strong demand for the company’s 13th Gen Intel Core processor family, which features Intel Thread Director technology and its second-generation performance hybrid architecture. The company expects to deliver more than 300 designs from partners across major multi-national corporations and leading manufacturers.

The company continues to innovate beyond the CPU to deliver premium PC experiences with Intel Evo Edition laptops and Intel vPro Platforms. It worked with industry partners to co-engineer and deliver new experiences with Intel Evo Edition, which are designed to deliver key experience indicators, such as responsiveness, battery life, intelligence collaboration, and Intel Unison Multi-Device Experience. Intel vPro is designed for enterprise needs and delivers increased productivity, connectivity, security features, and remote manageability.

The company operates in a particularly competitive market. In processors, it competes with Advanced Micro Devices, Inc. (AMD) and vendors who design applications processors based on ARM architecture, such as Qualcomm Inc. (Qualcomm) and Apple Inc. (Apple), with its M1 and M2 products. It expects this competitive environment to continue to intensify in 2024.

The company embraces and collaborates with a global ecosystem of industry partners to deliver leadership technologies together. It launched the industry's first AI PC Acceleration Program, designed to provide the software ecosystem with engineering tools and resources to enable AI on more than 100 million PCs through 2025. The company also announced a collaboration with Microsoft to drive the development of AI on personal computing, with Intel Core Ultra processors and Windows 11 expected to scale across the ecosystem of Intel and Microsoft OEM and independent software vendor (ISV) partners.

During 2023, the company continued to diversify its product strategy across nodes, advance its packaging capabilities with disaggregated silicon, and balance internal and external manufacturing. The company increased its levels of operating inventory and worked with its customers to develop strategically located supply hubs that forward position inventory. In addition, the company continues to invest in a globally diverse supply chain that enables it the flexibility and proximity to support customers. These have further enhanced the service and responsiveness the company is able to provide its customers.

DCAI segment

DCAI delivers cutting-edge workload-optimized solutions to cloud service providers and enterprises, along with silicon devices for communications service providers, network and edge, and HPC customers. The company’s unique capabilities enable it to help solve its customers' most complex challenges with the depth and breadth of its hardware and software portfolio, advanced packaging, and at-scale manufacturing made possible through a resilient, global supply chain. The company’s global customers and partners encompass cloud hyperscalers, multinational corporations, small-and medium-sized enterprises, independent software vendors, systems integrators, communications service providers, and governments.

The company launched the 5th Gen Intel Xeon processors in Q4 2023.

Products and Competition

The company’s products and services include:

A portfolio of hardware, including Intel Xeon processors, the Intel Xeon CPU Max Series, the Intel Data Center GPU Max Series, the Intel Data Center GPU Flex Series, Intel Agilex and Intel Stratix FPGAs, Intel eASIC devices, and the Intel Gaudi processors.

Platform enabling and validation in partnership with ODMs, OEMs, cloud service providers (CSPs), and independent software vendors.

Optimized solutions for leading workloads, such as AI, cryptography, security, storage, and networking, leveraging differentiated features supporting diverse compute environments.

The company provides its customers with an extensive portfolio of silicon and software products, engineered to deliver workload-optimized performance. The company’s hardware portfolio comprises CPUs, GPUs, domain-specific accelerators, and FPGAs, designed to support the performance, agility, and security that its customers demand. The deployment of the company’s silicon platforms is accelerated by a software development environment that enables workload mobility across its heterogeneous architectures and enables developers to execute their workloads on the hardware that best meets application requirements.

The company’s competitors include Advanced Micro Devices, Inc. (AMD), providers of GPU products, such as NVIDIA Corporation (NVIDIA), companies developing their own custom silicon, and new entrants and incumbents developing ARM- and RISC-V-based products customized for specific data center workloads. The company expects this competitive landscape to continue.

The Intel Xeon Scalable processor family delivers advanced CPUs for the data center, the network, and the edge, driving industry-leading performance, manageability, and security with differentiated features and capabilities. In 2023, the company launched the 5th Gen Intel Xeon Scalable processors, which utilize modular SoCs for increased scalability and flexibility to deliver a range of products that meet the growing scale, processing, and power efficiency needs for AI, cloud, and enterprise installations.

The company’s Intel Gaudi 2 AI deep learning processor is engineered to allow customers to benefit from the most high-performance training and inference alternative to comparable GPUs.

The company’s FPGA and structured application-specific integrated circuit (ASIC) portfolio enhances Intel's ability to meet the needs of customers in the data center, across the network, and at the edge. In 2023, the company released 21 new products within its FPGA business. These include the Intel Agilex 9 and Intel Agilex 7 product families, which are intended to handle the increased demand for customized workloads, including enhanced AI capabilities, and to provide lower total cost of ownership.

The company’s Intel Xeon CPU Max Series, introduced in 2022, was the first and only x86-based processor with high bandwidth memory for HPC and AI workloads. The Intel Data Center GPU Max Series 1550 and 1100 are broadly available through OEM systems. The company’s Intel CPU Max Series includes 64GB of on-package high bandwidth memory, which benefits data-intensive HPC workloads. Its Intel Data Center GPU Flex Series offers customers a flexible, general-purpose GPU for the data center and the intelligent visual cloud. The company delivered and installed, in collaboration with Argonne National Laboratory (ANL) and Hewlett Packard Enterprise (HPE), the largest cluster of Max GPUs to the Aurora Supercomputer at ANL.

The ubiquity of Intel Xeon in the installed base, along with the company’s heterogeneous compute solutions combined with software that unlocks the value of its hardware, enable its customers to develop highly differentiated solutions. The company’s integrated approach has created significant value for Intel, its customers, and its partners by helping it mitigate risks, reduce costs, build brand value, and identify new market opportunities to apply its technology to address its customers' and society's most complex issues.

NEX segment

NEX transforms the world's networks and edge compute systems from fixed-function hardware to general-purpose compute, acceleration, and networking devices running cloud native software on programmable hardware. The company works with partners and customers to deliver and deploy intelligent edge platforms that allow developers to achieve agility and to drive automation using AI for efficient operations while securing the integrity of their data at the edge. The company has a broad portfolio of hardware and software platforms, tools, and ecosystem partnerships for the rapid digital transformation happening from the cloud to the edge. The company is leveraging its core strengths in compute, connectivity, software, and manufacturing at scale to grow traditional markets and to accelerate entry into emerging ones.

The company launched the 4th Gen Intel Xeon processor with Intel vRAN Boost, and announced the Intel Xeon D-1800 series and the Intel Xeon D-2800 series processors optimized for cloud, edge, and 5G networks. The company announced 13th Gen Intel Core processors for Internet of Things edge and OpenVINO toolkit version 2023.1 with enhanced features for GenAI and edge computing. The company continues to work with its ecosystem partners like Ericsson, Nokia, Cisco, Dell Technologies, HPE, Lenovo, Amazon, Google, and Microsoft to drive the software-defined transformation of the world's network and edge infrastructure and accelerate AI-driven automation of physical operations.

Products

The company speeds the deployment of network and edge computing solutions based on its open software frameworks, AI-enabled platform solutions, and edge and network-optimized broad silicon portfolio to address a wide range of applications across several markets.

On-Premises Edge: More than just providing silicon, the company partners with companies to design and deliver solutions to help a wide range of customers transform their businesses and take advantage of the rapidly increasing number of connected and intelligent devices. The company develops high-performance, AI-enabled compute platforms that solve for technology and business use cases that scale across several industries, such as retail, education, manufacturing, energy, healthcare, and medical.

The company delivers edge-optimized AI-enabled platforms for edge applications based on its Intel Xeon, Intel Core, and Intel Atom processor portfolio, which reduces operational complexity for the company’s customers and helps its customers create, store, and process data at the edge so they can analyze it faster and act on it sooner. The company also builds differentiated networking offerings that keep pace with industry speeds and delivers unique features needed for the intelligent edge, such as networking offloads, time-sensitive networking, and scalable reliable transport.

Enterprise Networking: Enterprises are evolving their networks to connect new and varying environments, host services from anywhere between cloud and edge, deliver heightened service levels, and handle growing volumes of devices and data. The company is leading the world's shift to run networking workloads in software and create network function virtualization to provide its customers with more efficient, cost-effective, and programmable platforms that enable secure, agile, and reliable networking solutions from edge to cloud. The company works with its ecosystem partners of over 500 network builders to help enterprises optimize their networks with right-sized compute and connectivity requirements for current and future needs.

Telecommunication Networks: The company leads 5G core network deployments, demonstrating that 5G base stations can be almost entirely built from software running on Intel Xeon processors with Intel vRAN Boost. It continues to drive the transformation from fixed-function networks onto Intel Xeon Scalable processors and Intel Xeon D processors coupled with its FlexCore and FlexRAN software. The company’s customers are tier-one global communication service providers and their equipment suppliers. Its software-based cloud RAN platform is designed to allow operators to deploy the fastest cloud-native 5G infrastructure quickly and efficiently at scale to meet the needs of their end customers.

Cloud Networking: The company’s cloud customers require uncompromised data center network performance and reliability driven by increased networking investments to support AI cluster deployments. The company addresses these requirements by providing its open-standards-based NICs and IPUs. The IPU, a new class of product, is an open and programmable compute platform that frees up more compute cycles for customers by running infrastructure workloads in a separate, secure, and isolated set of CPU cores.

Software and Platforms: The company’s customers' need for flexibility, programmability, and versatility drives workloads toward software and away from fixed-function hardware. As networking in the cloud, core network, 5G, and private networks move to software, and as the company’s edge customers increasingly deploy AI applications, it aims to simplify innovation on Intel hardware. The company supports its customers' software strategy at the edge with an edge-native software platform with modular building blocks, premium service, and support offerings. The platform enables developers to build, deploy, run, manage, connect, and secure distributed edge infrastructure, applications, and edge AI. The platform is a horizontal approach to scaling the needed infrastructure for the intelligent edge and hybrid AI, as well as bringing together an ecosystem of Intel and third-party vertical applications. Offering unique optimizations for network, the Internet of Things, hybrid AI, and edge workloads on Intel architecture, the platform also broadly supports diverse architectures and can be consumed on a modular basis—avoiding vendor lock-in. The platform delivers a seamless cloud-like experience, combining truly edge-native capabilities for security and zero-touch management with the company’s deep industry experience and unrivaled ecosystem.

Mobileye segment

Mobileye is a leader in the development and deployment of ADAS and autonomous driving technologies and solutions. The company’s portfolio of solutions is built upon a comprehensive suite of purpose-built software and hardware technologies designed to provide the capabilities needed to make the future of advanced driver-assistance systems (ADAS) and autonomous driving a reality. These technologies can be harnessed to deliver mission-critical capabilities at the edge and in the cloud, advancing the safety of road users, and revolutionizing the driving experience and the movement of people and goods globally. The company’s customers and strategic partners include major global OEMs, Tier 1 automotive system integrators, and public transportation operators.

The company launched EyeQ-based systems into approximately 300 different vehicle models and built significant traction with its advanced portfolio of products, including Cloud-enhanced ADAS, Mobileye SuperVision, and Mobileye Chauffeur.

Products

The company ships a variety of ADAS solutions to a large number of global automakers. The company is recognized for its top-rated safety solutions globally, and since 2007, it has introduced numerous industry-first ADAS products.

The company is building a robust portfolio of end-to-end ADAS and autonomous driving solutions to provide the capabilities needed for the future of autonomous driving, leveraging a comprehensive suite of purpose-built software and hardware technologies. The company pioneered ‘base’ ADAS features to enhance vehicle safety and to meet global regulatory requirements and safety ratings with its driver assist solution and it has since created a new category of ADAS with its Cloud-Enhanced Driver-Assist and premium driver assist offerings, such as Mobileye SuperVision. By leveraging Mobileye SuperVision’s full-surround computer vision and True Redundancy, the company is developing Mobileye Chauffeur, its consumer AV solution and Mobileye Drive, its eyes-off/hands-off autonomous driving solution designed for fleet deployment. The company’s offerings to Tier 1 and OEM customers do not include cameras, radars, lidar systems, or other sensors (except in particular cases). The company intends in the future to offer radar and lidar products that are currently in development stages.

IFS segment

As the first Open System Foundry, the company enables its customers' transition from general-purpose monolithic chips to systems of chips tailored to high-growth applications, including AI, and optimize their solutions by combining the best technologies from Intel and the ecosystem. This combination of systems technology, systems expertise, ecosystem partnerships, and robust supply chain helps fuel the growth of the company’s customers, creates more robust global supply chains, and ultimately transforms the foundry industry. The company’s customers and strategic partners include traditional fabless companies, cloud service providers, automotive, and military, aerospace, and defense firms. The company also offers IMS mask-making equipment for advanced lithography used by most of the world's leading-edge foundries.

The company announced a multigenerational agreement with advanced RISC machine (ARM) and a definitive agreement with Synopsys. The ARM agreement is expected to enable chip designers to build optimized compute SoCs on the Intel 18A process. The Synopsys agreement expands the development of a portfolio of IP on Intel 3 and Intel 18A. These agreements and the IFS accelerator program are expected to enable customers to design using a robust suite of EDA and IP across IFS nodes, similar to the way they would design with their existing foundry supplier.

The company expanded partnerships under the Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) program created by the U.S. Department of Defense in 2021 to assure domestic access to leading-edge technology and the U.S.-based foundry ecosystem. The combination of expanded partnerships and RAMP-C enables customers to develop and fabricate chips on Intel 18A, including customers such as Nvidia, IBM, Microsoft, Boeing, and Northrop Grumman.

The company announced a commercial agreement with Tower, pursuant to which it is expected to provide foundry services and manufacturing capacity through its New Mexico advanced manufacturing facility for 300mm advanced analog processing.

Products and Competition

The company seeks to address this tectonic shift in the chip industry by enabling its customers to create optimized systems of chips by combining the best technologies from Intel and the ecosystem. Open System Foundry is a foundry offering, delivered from a resilient, secure, and sustainable source of supply and complemented by access to the systems of chips capabilities from Intel. The basic foundry offering is advanced process technologies backed by an ecosystem of IP, electronic design automation (EDA), and design services, which enable customers to design as they would with other foundries. The systems of chips capabilities include advanced packaging technologies, software to accelerate bring-up and integration of complex chips, and driving standards that will improve system performance.

With its IFS accelerator program members and the Arm and Synopsys agreements, the company is well on the way to building out a world-class foundry offering. With the rise of AI, the company’s advanced packaging business is expected to be another unique advantage for Intel. Chips created with the company or other foundries can be packaged using Intel's advanced packaging technologies, including 2D and 2.5D/3D solutions designed to enable large, highly scalable packages at competitive costs. The company continues to drive technologies, capabilities, and standards needed to optimize systems of chips, including the Universal Chiplet Interconnect Express standard for communication between chips in a system, which was demonstrated in silicon in 2023. The company accelerates its customers' designs by providing services and software that leverage Intel's vast experience as a systems company.

The company’s competitors are mostly pure-play foundries that focus on delivering a pure-play foundry offering from fabrication plants based primarily in Asia. Of the five major semiconductor foundries, Taiwan Semiconductor Manufacturing Company (TSMC), Samsung, Global Foundries (GF), United Microelectronics Corporation (UMC), and Semiconductor Manufacturing International Corporation (SMIC), only Samsung is an IDM and foundry, and only GF is headquartered in the U.S. TSMC leads the market with 59% market share, followed by Samsung at 16% in 20221. Neither Samsung nor TSMC offers its most advanced nodes outside of Asia and both have limited advanced node capacity in the U.S.

Strategy

The company’s strategies are to lead and democratize compute with Intel x86 and xPU; deliver open software and hardware platforms with industry-defining standards; intend to remain a leading developer of process technology and a major manufacturer of semiconductors and will continue to build the majority of its products in its factories; expand its use of third-party foundry manufacturing capacity, which will provide the company with increased flexibility and scale to optimize its product roadmaps for cost, performance, schedule, and supply; build a world-class foundry business to meet the growing long-term global demand for semiconductors; and focus on executing the company’s product and process roadmap and accelerating its cadence of innovation.

The company’s strategy is to develop more competitive products and more capabilities for customers.

Customers

The company’s sells its products primarily to OEMs, ODMs, and cloud service providers. ODMs provide design and manufacturing services to branded and unbranded private-label resellers. In addition, the company’s customers include other manufacturers and service providers, such as industrial and communication equipment manufacturers and other cloud service providers who buy its products through distributor, reseller, retail, and OEM channels throughout the world.

Intellectual Property (IP) Rights

The company has obtained patents in the U.S. and other countries.

Trademarks

Intel, Arc, Arria, Celeron, Intel Agilex, Intel Atom, Intel Core, eASIC, Intel Evo, FlexRAN, Granulate, the Intel logo, Intel Optane, Intel Unison, MAX, Movidius, OpenVINO, OpenVINO logo, Pentium, Stratix, Thunderbolt and the Thunderbolt logo, Intel vPro, and Xeon are trademarks of the company or its subsidiaries.

The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by the company is under license.

Research and Development

The company incurred research and development expenses of $16.0 billion in 2023.

History

Intel Corporation was founded in 1968. The company was incorporated in California in 1968 and reincorporated in Delaware in 1989.